Samsung Electronics Establishes BEOL Process Organization Focused on HBM4 Memory

Samsung Electronics' semiconductor division has formed a BEOL (Back End of Line) process organization within its memory business unit's etching technology team. The organization is set to be completed this month and will begin operations at the Pyeongtaek campus, initially comprising about 30 personnel. This organization mainly consists of senior engineers and will focus on discussions regarding BEOL process technologies for high-value memory such as HBM (High Bandwidth Memory), personnel allocation, and strengthening supply chain operations. BEOL is the process of forming metal wiring in the latter stages of semiconductor front-end processes, used to connect various devices and transmit signals after wafer devices are formed. Samsung Electronics began shipping HBM4 in the first half of this year, featuring 2048 I/O (Input/Output) connections, which is double that of the previous generation. Increasing the number of I/O connections within a limited chip area requires denser wiring and smaller line widths, thus raising the demands for metal wiring formation and etching precision. The organization is still in its early stages, and specific operational directions and goals will be clarified in the future.

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